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Technofile : Wafer thin

7 March 1998

Tiny features only 0.08 micrometres wide have been etched on a semiconductor
wafer. The features are just a third of the size of those on production chips.
Researchers at the University of Texas, Austin, did this by using a
short-wavelength ultraviolet laser and developing a photo-resist that could cope
with UV light at this wavelength.

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